Hi...

We are using TMS320DM368 part in our design which, as known, comes with the BGA package. The pitch between two balls in this package is 0.65mm. To route the signals out from the pins we had to place vias between the BGA pins with dimensions: 8 mil drill on 15 mil pad (not a standard via. Standard BGA via is 8 mil drill on 18 mil pad). But the PCB manufacturer who build the prototype for us conveyed that they don’t support 8 mil drill on 15 mil pad (Not capable to manufacture). Placing the 8 mil drill on 18 mil pad between the BGA pins will violate the design rules. Considering all this we had to go for the next technology available i.e. laser drilled blind via where blind via of 4mils on 10mil pad stacked between L1-L3 which are placed in between the BGA pins.

 We are concerned about the cost of PCB manufacturing as the PCB with blind vias will cost almost double the cost of a PCB with normal vias.

 Based on the above scenario I have the below queries:

1.       Whether the TMS320DM36x Evaluation Module (TMDXEVM368) board has used the blind vias while routing the signals from DM368?

2.       If not is there any PCB fabricator India who can manufacture 8 mil drill on 15 mil pad via?

3.       Is there any other technology which we adopt for routing the signals from DM368?