We are using the OMAP4430 on a Panda Board for our product development.
In our application the OMAP is overheating and we would like to add a heat sink to allow for an extended range of operation. The OMAP4430 data sheet provides thermal resistance numbers for Junction to Ambient but not Junction to Case.
1) Can the POP package be used with a heat sink? (With the memory module on top of the MPU module there may not be a good heat transfer to the top of the package)
2) Do you have the Junction to Case Thermal resistance value so I can choose an appropriate heat sink?
3) Do you have a recommendation for a heat sink where no fan (nor forced air) is provided.
4) we are doing a lot of video processing, are there power management options that could reduce our dissipation while doing video processing?