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OMAP4430 Thermal Characteristics

Mark Smith4
Prodigy 10 points

We are using the OMAP4430 on a Panda Board for our product development.

In our application the OMAP is overheating and we would like to add a heat sink to allow for an extended range of operation. The OMAP4430 data sheet provides thermal resistance numbers for Junction to Ambient but not Junction to Case.

1) Can the POP package be used with a heat sink?  (With the memory module on top of the MPU module there may not be a good heat transfer to the top of the package)

2) Do you have the Junction to Case Thermal resistance value so I can choose an appropriate heat sink?

3) Do you have a recommendation for a heat sink where no fan (nor forced air) is provided.

4) we are doing a lot of video processing, are there power management options that could reduce our dissipation while doing video processing?

  • 0
    TI__Intellectual 1310 points

    Hello Mark,

    Here are my answers to you questions:

    1) In our own testing and recommendation, we specify using a heat spreader instead of a heat sink. If you plan to use a thermally conductive glued on heat sink you may be able to get away with using a heatsink on top of POP memory. If you plan to use a screwed on heatsink, then I would recommend not doing so. We do not have any data at present time that speifies the max force a POP package can withstand.  You will need to consider stress imposed by a screwed on heat sink both on OMAP4 die/package as well as POP memory die/package. Irrespective of whether you go the heat spreader or glued heat sink route, the point you made about heat transfer in question 1 still applies to both approach, neither approach removes heat from OMAP4 package directly. We have an application note that talks about OMAP4 Thermal strategy, which uses both HW and SW techniques to manage thermal issues. From HW perspective you need to ensure that you have an external temp sensor on your board, placed close to OMAP and secondarily you can use a heat spreader. You will also need to implement a SW thermal management policy that will help manage thermal dissipation of the device. Because this is an external E2E forum, I cannot send you such documents. Please contact your local TI Sales/Mareketing person, and if you have an NDA with TI, they can provide you with such documents.

    2) I am checking with our packaging team on Theta JC value and will update you later on this.

    3) There are some recommendation in our OMAP4430 thermal application note, again please contact your local TI sales for such information. I cannot send you this information via this forum.

    4) Yes, we have both a HW and SW based thermal management policy that you can use.

    Regards,

    Shaheen

     

    There are several aspects to be considered : Stress on Silicon that may affect functionality, Package breakage, BLR effect in TC and  solder balls creep over time.

  • 0 in reply to Shaheen Saroor
    TI__Intellectual 1310 points

    With regards to Theta JC, we do not specify this number for OMAP4430 because by default there is a memory package connected on top of it. There is no way for customers to connect OMAP4430 package to case, since you need LPDDR2 POP memory which sits on top of OMAP4 package.