Hi,
I have a question about AM335x PCB Design.
We are planning to use AM3357 ZCZ package, and want to know about
pad size and metal mask opening size.
I found application note for nFBGA package.
http://www.ti.com/lit/an/spraa99/spraa99.pdf
In page.6 "Figure 6. Optimum Land Configurations",
there is a table which shows the pad size and stencil opening size for each ball pitch size.
I think that I can refer to this application note because AM3357 is nFBGA.
Am I right?
best regards,
g.f.