Dear support team,
Are there any layout recommendations or a reference design regarding the optimization of the thermal resistance between the AM335x and the PCB ? In other words: What do we have to consider, when doing the PCB layout in order to get as much heat as possible away from the processor to the PCB planes ? In our current design the processor heats up to approx. 50°C and we don’t know whether this is because of a poor layout or if there is another issue.
Best regards
Reto