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Are TMS320C6455BGTZA and TMS320C6455BCTZA pin-to-pin replacements?

Other Parts Discussed in Thread: TMS320C6455

Hello.

I have a question about two variants of TMS320C6455. GTZ and CTZ packages are drawed in datasheet. Outlines and pin numbers of these packages are the same. But there is one difference between devices in "MSL Peak Temp" column: for TMS320C6455GTZA - Level-4-220C-72 HR, and for TMS320C6455CTZA - Level-4-245C-72HR. If i understand correctly, there is a diference only in soldering temperature. The main question is: can these two parts be pin-to-pin replacements for each to other? Or there are some problems that may prevent it?

  • Hi --- CTZ is the Pb-Free die bump and solder ball (GREEN) equivalent of GTZ. They are totally pin-for-pin compatible.

  • Thanks for answer, but i would to specify.

    Is it correct, that
    CTZ has completly Pb-Free die bump and solder balls;
    GTZ has Pb-Free die bump and Pb-ed solder balls;
    ZTZ has Pb-ed die bump and Pb-Free solder balls?

  • Vyacheslav,

    We provide details on the packaging on our TMS320C6455 Product Folder and from the links provided there. Please go to the TMS320C6455 Product Folder (link provided), and then go to the Quality & Environmental Data section, where the various packages are listed. You will see a short summary in that table, and comments at the bottom of the table explaining to use the View links under the Details column for more detailed information.

    For quality delivery of this information, it is best for us to provide this data in a single location and provide the means to find that information, instead of interpreting that data when we re-write it onto an answer on the forum. This is the best way to make sure you are getting the full and accurate answers to your questions.

    Does this extra detail from those links resolve your questions?

    Regards,
    RandyP