Hi,
We need some advice on reducing the Heat dissipation with AM3352.
with several tests, the Heat dissipation on our customer's prototype board(AM3352)
seems to rise till 105°C.
But the device itself is industrial junction temperature(-40 to 90°C)
and we would like to know if there is any way to reduce the Heat dissipation
like using "low power modes", "layout design" etc.
The prototype board is desined as per the Schematic_Checklist on the wiki page,
please let us know if there is anything else or recommendations in such case.
Regards,
Prad.