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DDR3 Issues In C6678

Dear All,


I have certain Douts Regardig Mounting of Resistor and Capacitor of DSP0_DDR3_ECKP_0, The Resistor R37,R38 & Capacitor C31 from schematic of EVM.

In the Evaluation board there there are certain resistors and capacitors are mounted near the DDR3 Chip.

The DSP0_DDR3_ECKP_0 is connected to R37,R38 & C31 . I have also attached the schematic of the EVM i am refering. With Reference to the Page No.13

Whether the R37,R38 & C31 should mount near the DDR3 Chip?

Suppose if the DDR3 Chip and the processor are mounted on top of the board and the R37,R38 & C31 are mounted on bottom of the board. Will it cause any issue?

8360.TMDXEVM6.PDF

Regards,
Avinash N

  • Avinash,

    R37, R38 and C31 on the C6678 EVM are the termination components for the DDR clock from the DSP to the memories.  These should be co-located with the VTT termination components for the address, control and command nets.  Clock, address, control and command nets all need to be routed in a fly-by arrangement with the terminations AT THE END, after the memories, farthest from the controller (DSP).  The JEDEC UDIMM spec discusses topologies that make this routing clear.

    Tom