Recommended implementation parameters for AM3352

Nomo

Other Parts Discussed in Thread: AM3352

Hello,

Could you teach me following parameters for AM3352?

1. recommended land diameter for the printed-circuit board
2. recommended thickness of the metal mask and recommended diameter of the hole for footprint of AM3352

Best Regards

Nomoto

over 12 years ago

0 Biser Gatchev-XID over 12 years ago

TI__Guru**** 393215 points

Hi Nomoto-san,

Check this document: http://www.ti.com/lit/an/spraa99/spraa99.pdf

0 Nomo over 12 years ago in reply to Biser Gatchev-XID

Guru 16800 points

Hello Biser-san,

Thanks to your reply and I could find the answer for question 2.
It is described at page 6, thickness = 0.15mm and opening = 0.40mm for ZCZ package (0.8mm ball pitch).

However, I couldn't find the answer for question 1 ("Land diameter on PCB").
The document describe "Ratio A/B should equal 1.0 for optimum reliability" at page 5, but parameter A (Via diameter on package) value isn't described anywhere (not only the document but also datasheet).
So, please teach me the parameter for AM3352 ZCZ package.

Best Regards

Nomoto

0 Biser Gatchev-XID over 12 years ago in reply to Nomo

TI__Guru**** 393215 points

Look at Figure 6 on page 6 and the table below it. Parameter B is the pad diameter, and parameter A is the solder mask diameter,

0 Nomo over 12 years ago in reply to Biser Gatchev-XID

Guru 16800 points

Hello Biser-san,

I wanted to know the land diameter.
I think that Figure 6 shows the mask parameter.
The land diameter is described in "http://processors.wiki.ti.com/index.php/General_hardware_design/BGA_PCB_design", I could find.

Best Regards

Nomoto

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Recommended implementation parameters for AM3352