Power dissipation

Aravind,

We generally use the two terms interchangeably. Although that might not be technically correct at the physics level, all of the power consumed by the device must be dissipated as heat. Your design has to dissipate all of the power consumed sufficiently to maintain a case or junction temperature as specified by the datasheet.

Is your concern over the distinction of the two terms, or are looking for hardware design advice for thermal dissipation?

Regards,
RandyP

Hi Randy,

Thank You for replying, I looking for hardware design advice. In the datasheet of TMS320C6454 they have specified CORE POWER CONSUMPTION  = 1.41W and I/O POWER CONSUMPTION = .53 W (when CPU IS OPERATING AT 800 MHz). So can I take total power dissipation from the device = 1.41+0.53 W for the calculation?

Thank you,

--

Aravind D. Chakravarti

Aravind,

Please refer to the Power Consumption Summary application report. This is listed in the TMS320C6454 Product Folder under Application Notes.

It is correct to add the core power + I/O power to get the total power for this device, according to the summary at the beginning of that document.

Regards,
RandyP

Aravind,

The C6454 has a power consumption App Note and Spreadsheet at: http://www.ti.com/litv/pdf/spraae8b and http://www.ti.com/litv/zip/spraae8b.  All power consumed must be dissipated as heat.  The Data Manual http://www.ti.com/lit/gpn/tms320c6454 shows the thermal properties of the package in Section 8.  Thermal modeling may be needed to prove that you have a robust design.  Is this device on a sparse board or is it crowded with other heat generating devices?  If the air space and/or air flow is restricted, a heat sink may be needed.

Tom