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About package of TCI6618

g.f.
Guru 15520 points

Hi,

I have a question about TCI6618 package.

From TCI6618 datasheet page.222,
it looks like that the package is made by 3 Layer.

Middle layer is smaller than top and bottom layer,
so there are space between top and bottom layer.
I am anxious about the durability of package.

Q1. When pressure is applied to a lid, can the package bear enough
    from the pressure?

By the way, I have check the C6678EVM(which is same package as TCI6618).
Something is mounted in the four corners between top and bottom layer
which isn't written in datasheet. I will attach the file, so please take a look.

Q2. Is this mounting only for EVM or is it product specification?
Q3. Is it for preventing damaging, when pressure is added to top layer?
Q3. If this is correct, may I understand that it is satisfactory in durability?

best regards,
g.f.

C6678 package.pdf
  • 0
    TI__Mastermind 30825 points

    G.F.

    TCI66xx devices are only supported through our Field Applications Engineers (FAEs.)  They are not supported on the E2E forum.  Please work with your local FAE for support of the TCI66xx devices.  If you do not know who your local FAE is, then please contact your local field sales office and they will be able to put you in contact with your local FAEs.

    Best Regards,
    Chad 

  • 0 in reply to Chad Courtney
    Guru 15520 points

    Hi Chad,

    Thank you for the reply.
    And I'm sorry for posting to the E2E.

    I will conatact to our local FAE.

    best regard,
    g.f.