This post is to document an issue that that cost two of us (hardware and software engineers) more than a week to debug, resulted in us having to make a very tricky modification to our prototype, requires a new revision of the PCB and that could have been avoided if the TI documentation had been complete at the time of designing the PCB.
We posted our original question on the forum:
https://community.ti.com/forums/t/10475.aspx
and did not receive any response from TI staff regarding this issue, and then with more thorough investigation with the latest revision of the data sheet we solved the issue.
As far as the CBC package is concerned, please note that CLE is not connected to the POP memory (as it is for the CBB package) and must be routed on the PCB between the gpmc_nbe0_cle ball (K2) and a feed through ball on the bottom (AF12) which connects to ball AA10 on the top, and hence to the CLE pin on the Micron POP Memory. This information was only clarified in "Table 2-30. CBC Package Feed-Through Balls" which was added to the August 2009 Revision of "OMAP3530/25 Applications Processor" (the data sheet - document # SPRS507E).
We want to make sure that no one else encounters this problem and wastes a lot of time as we did.