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Comments on how hot TI's TMS320C6657 DSP gets (Power Consumption)

Other Parts Discussed in Thread: TMS320C6657

Hello, I am planning on using one TMS320C6657 on my next design. I'm expecting to use the following configuration:

Operating Frequency: 800-Mhz
DDR3 Disabled
SRIO Enabled: 1 Lane, Mode DIO, % Utilization 50
EMAC 1Gbe: % Utilization 50
Hyperlink Disabled
McBSP Not sure if I need it
PCIe: Disabled
SPI: Enabled
UART: Enabled
MSMC: not sure if I need
Navigator: not sure
EMIF 16: Enabled
UPP: Enabled
VCP2: Disabled
TCP3d: Disabled

CorePac 0: Enabled: % SP Utilized 50, % CC Utilized 50
CorePac 1: not expecting to use CorePac 2

The Power Estimation Spreadsheet calculated 2.5W.

I want to use the least amount of power and add  a sufficient heat sink to keep the Case cool and the power consumption low.

Can anyone comment on how hot I should expect the device to get base on this configuration? Please share any comments you might have.

Thanks,
joe

 

 

  • Hi Joe,

    The temperature is highly dependent on the environment in which the C6657 is used. You can use the information in the Thermal Design Guide for KeyStone Devices from the C6657 product page to determine whether a heat sink is required for your design. 

    Regards, Bill