Other Parts Discussed in Thread: AM3517, TPS65023
HI!
I have AM3517 EVM and run defalut demo. the CPU board has thermal issue. the temperature is too high. I measure another EVM and got same result. Is this silicon bug or EVM problem?
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kai said:I have AM3517 EVM and run defalut demo. the CPU board has thermal issue. the temperature is too high. I measure another EVM and got same result.
How high of temperatures are you measuring, and how are you measuring them?
The AM3517 will generate significant heat when running at full load, to the point that the processor would be hot to the touch, but the EVM should still be operating within the thermal requirements of the part even at full load.
kai said:Is this silicon bug or EVM problem?
I am not sure that this is necessarily either yet, assuming the heat you refer to is not damaging the EVM in any way. If it was either my first suspect would be the EVM. In general the EVM is not the most optimized design possible, as it is designed quickly with early silicon specifications, so it is possible a customized design would have better thermal properties, most likely larger copper planes to let more of the board act as a heat sink, which are somewhat limited on the SoM board due to smaller surface area.
EVM works fine but the temperature will go high to 55 C by my measurement case. (by IR thermal reader)
Turn on EVM with build in 3D demo for around 10 minutes. I have 7 EVM and all of them with similar result.
EVM information:
TMDXEVM3517-3
LOT: LO103009A
KIT PN:1013686 Rev 5
KIT SN:4309M01077
SOM: 1013636 REV 7
Test Result:
Surface center of AM3517 is around 55C.
Three corners of AM3517 are around 52C, the other corner is around 47C.
U10, SMSC 3320 USB phy for USB host will go high up to 60C (the highest temperature on SOM)
DRAM chip close to U10 is around 52C and another far from U10 is around 48C.
TPS65023 is around 53C.
Other user case put Linux on, CPU loading around 0%, no 3D demo. Result similar.
Conclusion, it looks like there may be some short issue on USB3320 or wrong setting on USB. Power dissipation may be derived from USB3320 (U10).
We have reported this to LogicPD already. Waiting for update.
Best Regard,
Rich
Rich,
This is a known issue within a subset of the first build of SOMs. There was insufficient solder on the ground pad of the ethernet chip. This issue has been fixed in all new SOMs and should no longer be an issue.
Thanks