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Having Trouble at Cold Temperature while Using a McBSP Port Configured as SPI Bus Master

In my application, I have one device always connected to the SPI Bus where the McBSP is the Master and an AT45DB161D Flash Memory chip is the SPI slave. This device is fairly complex and supports many commands. They all work based on a command followed by a response. To send a command, a message (in my case 8 bytes long) and then a response occurs with data transmitted back for as long as your clock it. During the entire time, the memory chip select must remain active. The command I send is a Read Command of a page of Flash Memory.

I am reading the data from a series of Flash Memory Pages which happen to be 528 Bytes long.  Due to the limitations of the TMS320C6713B McBSP port namely that the chip select can not be programmed to be active for more than 4096 clock cycles, I broke-up the problem of reading the flash page into 8 chunks each 74 bytes long with 8 bytes associated with the command and 66 bytes of data.

I programmed the RCR and the XCR as single phase system with a length set to 73 decimal (elements) with each element set to 8 bit length to give me a 74 byte message.

I have the EDMA channels associated with the McBSP transmitter and receiver set-up to transmit the desired command followed by zero data in the case of the transmitter and a receiver buffer set-up to receive the data from the Flash Memory chip.

We have been procuring boards from a third party since 2008. They use the a 300MHz DSP chip in the 272 Pin PGA package. We take the board and derate it down to run a 200 MHz and run the external bus a 80 MHz. We have used 72 boards with all but 3 boards operating down to -40 C.  Those 3 boards operate at least to -20 C and then problems appear to happen. At the coldest temperature, the chip select (i.e., the FSX output) is eratic (not a logic 1 or zero) but a signal not well synchroized to the clock and could be at a low voltage less than a volt. It never returns to a high level.

The processor itself is fully operation. Only the McBSP appears affected.  Could you find out if the chip has known performance issues relating to the McBSP over temperature and when parts screened to -40 C to 125 C this capability is tested. We are concerned because when the last 10 boards were procured from our supplier, 2 boards in the group failed at cold temperature.

The Clock appears to look the same on a scope, occasionally the DX output transitions to low and high a little slow with the signal below 0.5 volts taking much longer to decay.  As stated before the FX output looks really bad (not able to go to a legal "1" voltage.

I have tried to run the McBSP at 5 MHz vs 10 Mhz and it has no affect on the temperature behavior.

Before the signal degradation is observable on a scope, the memory chip fails to respond. I am always able to read the transmitted data with my Total Phase Analyzer in all cases. The decay of the DX line and the rise only occurs near the edges of the FX transitions well before any clock is activated (which explains why the Beagle Analyzer is unaffected by the degration).

We have tested with a few I/O Boards and a few CPU Boards, the problem always follows the CPU Boards.

Bob Bianchi

  • Hi Robert,

    Thanks for your post.

    I don't think, the probability of chip having issue only with McBSP over cold temperatures would be unrealistic. I guess, the issue would be with power supplies or badly initialized signal pins (weak pull-up or pull-down) and also, there could be other possibilities to think of.

    I think, you have the estimate the power for your case temperature and validate the same. To be specific, you have to measure the baseline power consumption (includes static power, PLL power, clock tree power) which purely depends on the temperature and voltage levels and like wise, calculate the activity power consumed by the active parts of DSP (cpu, edma, peripherals etc.) Kindly refer the application report below to look for power estimation spreadsheet in section 2 and also refer section 1.1 & 1.2 for baseline power and activity power

    http://www.ti.com/lit/an/spra889a/spra889a.pdf

    Also, there are case temperature measurement considerations  mentioned in the application report below which i think, it would be useful to understand the maximum case temperature specification of the device

    http://www.ti.com/lit/an/spraal9/spraal9.pdf

    Kindly try the below options but this wouldn't be a trivial solution to find the cause of issue, but if possible, you can make it out:

    1. If you have any chance to swap parts between a working board and a failure board, so that, you could filter out quickly whether the failure could be with the board components, or board manufacturing or DSP chip failure and the probability of board manufacturing defect would be very minimal.

    2. Once you see the failure in the defect boards, you could power down the board and immediately power up back and check your observations. Also, one other option you could try is to wait for a while before you power up back after you power down on a faulty board.

    There are some application notes and Wiki topics to give you some guidance in this debug process and also you could refer the TI wiki pages and search for "hardware debug" and also for "checklist" to find some helpful information.

    http://processors.wiki.ti.com/index.php/Main_Page

    Please refer the c6713 hardware designer's resource guide as below since you will not get directly this in the c6713 product folder under technical documents

    http://www.ti.com/lit/an/spraa33/spraa33.pdf

    The datasheet has specifications like power sequencing, voltage levels and clock & reset requirements. All of these must be met as specified there. Please refer the datasheet below:

    http://www.ti.com/lit/ds/symlink/tms320c6713b.pdf

    Thanks & regards,

    Sivaraj K

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