This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

TMS320VC5510 - Rework questions

Hello,

We have an application that uses multiple TMS320VC5510AZGWA2 devices.  Due to an error that occurred in the design, there is rework that needs to be done that involves attaching a wire to the top side of this TI DSP that is connected to pin G4 (Address 14).  This part has an exposed substrate on the top side providing access to exposed traces that connects to each pin/ball.  The rework involves attaching a 36-38 AWG wire to this fine trace.

This rework is a temporary fix and will not be part of our production design.  The boards will be rebuilt to fix this error at a later date.  However, we do want to perform some prequalification testing (EMI & environmental) prior to making this board change.  The question our management has asked is if we our compromising the reliability of the part when performing this rework.  Functionally the modification has been verified.

**The open question is if there is likely any damage that we are inflicting on the part by attaching the wire to the exposed trace on the DSP part?**

  A certified technician performs the soldering and we try to minimize the heat exposure to the part.  We are not asking for a guarantee but more for a risk assessment in making this change.

  • After contacting our packaging and quality engineers, we really cannot assess the reliability risk on this because we do not have any statistical data to create an assessment.

    Nonetheless, there is a note hopefully be useful for your own assessment:

    The traces on top of the substrates are under a solder mask. You have to burn off the mask material to get to the trace. Lastly, as you stated, such approach will negate the product warranty.

    Hope this help.