C6657 DIE information

David Tate

Does anyone have information on the C6657 Flip Chip DIE? I would like to use the DIE on my own substrate, but need the DIE pad to package mapping.

thanks,

David

over 10 years ago

0 Senthilkumar Srinivasan over 10 years ago

TI__Mastermind 43660 points

Hello David,

The C6657 device package is FCBGA and its packaging information are available in below reference guide. I think you can find the required information in this guide.

http://www.ti.com/lit/ug/spru811a/spru811a.pdf

You can also try to find more information in the below thread.

http://e2e.ti.com/support/dsp/c6000_multi-core_dsps/f/639/p/216848/764490.aspx#764490

Regards,

Senthil

0 Chad Courtney over 10 years ago

TI__Mastermind 30825 points

David,

If I understand you're question correctly, you're wanting to use our devices DIE inside your chip / package.

I do not believe we have a particular procedure to support such a procurement. For one all of our DSPs are test after packaging. There are some wafer probe testing but it's not the final testing.

If you wish to discus the possibly procurement of raw DIE's you would need to contact your local field sales representative and start a discussion there to determine if this would even be considered.

As for the DIE bump to package mapping, it's not some we distribute since as mentioned, we do not sell the DIE's directly.

Best Regards,

Chad

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C6657 DIE information