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question about the omap processor

AnonymousContent
Expert 4605 points

Other Parts Discussed in Thread: OMAP3530

Dear All, I have this question about the OMAP 423 BGA CUS package. According to the OMAP datasheet for the OMAP35x devices, the CUS package has the BGA pins on the bottom side. I want to ask, then how is the special POP memory which is used in the OMAP devices interfaced, when all the pins are at the bottom of the CUS package? or am I mistaken and it is not so, and thus it has memory interface pins for the POP packages on the top like the the other package configurations. Thank you.
  • 0
    TI__Guru 64940 points

    The POP memory devices are only supported on the CBB and CBC packages.  The CUS package does not support POP memory as it does not have pads on the top side of the package.

  • 0 in reply to BrandonAzbell
    TI__Expert 4605 points

    Hi,

    I am asking this because the CUS package seems to be so much easier to work with. So, it is clear that the POP cannot be used in that case. But now, do we have to place what is on the POP memory package, I mean the flash, the DDR memory, on the PCB in case of the OMAP CUS packages? Does this work, is the CUS package not supposed to be used for the nand, ddr or sdram interfacing?

    best regards.

  • 0 in reply to AnonymousContent
    TI__Guru 64940 points

    ghasem22 said:

    I am asking this because the CUS package seems to be so much easier to work with.

    And there are others that agree with you.  It all depends on your application needs and capabilities of the PCB & Assembly house that you are using.

     

    ghasem22 said:

    So, it is clear that the POP cannot be used in that case. But now, do we have to place what is on the POP memory package, I mean the flash, the DDR memory, on the PCB in case of the OMAP CUS packages?

    Yes, this is the implication.  This should be no different that any other processor that you may have worked with in the past.

     

    ghasem22 said:

    Does this work, is the CUS package not supposed to be used for the nand, ddr or sdram interfacing?

    I don't know how you are coming to this conclusion.  NAND memory, DDR memory, etc. also come in a variety of packages that are non-POP type.  Yes, the OMAP3530 CUS package can be used to interface to Flash memory types like NAND and NOR as well as mobile DDR.

    Inspection of the OMAP3530 datasheet for the CUS package indicates that both the SDRC (DRAM controller) and GPMC (asynchronous memory controller for flash, etc) interfaces.

  • 0 in reply to BrandonAzbell
    TI__Expert 4605 points

    Ok, I agree. I will just go ahead and ask this, that I want to have a device recommendation on both the DDR type and NAND type memory to be used with the CUS OMAP package, since all the information and design files which I see are using the POP type memory. i mean that there is no reference design on the CUS Omap. This would be very helpful, memory is a vital part of the over all design. Best regards.

  • 0 in reply to AnonymousContent
    TI__Expert 4605 points

    In the last post i said there are no device recommendations for external memory types. Ok, that is not true and I found a recommended memory type, still am not sure though. still there is no reference design though on the CUS package. Now I want to ask one thing. what about the drivers and the software? Suppose, steps are taken, that two packages, such as the CBC and CUS have exactly the same hardware designed and placed in the same I/O lines, chip enables, etc. , then would for example a linux or any software infact run the same on both the package types? I mean would the same software running on the CBC package with 256 Mb nand and 256 mb flash run on the cus package with 256 mb nand and 256 mb flash?

    Best regards.

  • 0 in reply to AnonymousContent
    TI__Guru 64940 points

    Provided that you use the exact same signals, then yes the configuration of the interface would be the same and software accessing those memories would behave the same.