AM437x using BGA underfill

Daisuke Maeda

Guru 20205 points

Our customer wants to use underfill between the package and PCB for AM437x. Is the underfilling allowed?

What materials should be used? What characteristics should the material have?

Best regards

Daisuke

over 10 years ago

0 Biser Gatchev-XID over 10 years ago

TI__Guru**** 393215 points

Hi Daisuke-san,

I don't believe TI has any requirements or documents on this. I will ask the factory team, but I think this should be discussed between your customer and their PCB assembly factory.

0 Daisuke Maeda over 10 years ago in reply to Biser Gatchev-XID

Guru 20205 points

Hi Biser-san,

Thank you for your reply.

I would like to wait for the feedback from the factory team. Any advice or information you could provide would be greatly appreciated.

Best regards,

Daisuke

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AM437x using BGA underfill