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6657 DSP is Dead

Hello Ti experts,

i am using C6657 DSP with my custom board which is having micro controller and FPGA. i am testing continuously for two days my custom board. As my DSP is sending and receiving messages to host PC continuously and i am also testing continuously my interfaces for FPGA and DDR3 RAM. Please tell me which problems lead to DSP dead.In this case i see the DSP is overheated.

Thanks,

Ram.

  • Hi Ram,
    I did not understand the question. Is the continuous testing failed and DSP is overheated?

    Thank you.
  • Hi Raja,

    The DSP chip is complelty crashed, the custom board is also crashed. so we thought the customboard is crashed because the DSP is crashed,FPGA is still alive. so i am trying out the reasons why the DSP chip is crashed.

    Thanks,

    Ram.

  • Hi Raja,

    i make a debug build and debug .out file. do you think thermally it makes much difference with release build for the DSP chip?

    Thanks,
    Ram.
  • Moved this thread over keystone forum.
  • Hi Ram,
    It is also depends on how you are managing the task in your code.
    Do you have proper heat sink for your C6657 processor ?

    Did you try the same on C6657 EVM board ?
  • Hi,
    because i have only two tasks running parallel, when i every time my test runs. do you think this effects the temp of the chip?where i have to use the heat sink, please explain me more. i can't able to try on EVM-Board, as i wrote the code for my customboard which does not work for EVM, because of the plls and clocks configuration.

    Thanks,
    Ram.
  • Hi Ram,

    do you think this effects the temp of the chip? where i have to use the heat sink, please explain me more.  

    Yes. The over temperature can cause the device failure. Do have C6657 EVM with you? Our C6657 EVM has the heat sink mounted on it. Look at the second image below.

      i can't able to try on EVM-Board, as i wrote the code for my customboard which does not work for EVM, because of the plls and clocks configuration.

    1. Have you ensured that the custom DSP is dead? Please try to connect to DSP core using emulator/debugger on custom board.

    2. How are you running the program in custom board using emulator(CCS) NO BOOT or Flash boot mode? 

    Flash mode:

    Re-build the project after commenting the PLL and clock configuration. Connect the EVM with gel file to init PLL and clock configurations using emulator.  Load and run the program.

    No boot (Emulator mode):

    Connect the EVM with gel file to init PLL and clock configurations using emulator. Load and run the program.

    Note: The EVM gel file can be found in MCSDK2.x directory

  • Hi,

    i have the heat sync on the custom board.

    1. Have you ensured that the custom DSP is dead? Please try to connect to DSP core using emulator/debugger on custom board.

    A)No i haven't connected with the debugger. But our hardware guys told the DSP chip is already too heated, so no help if we also connect the debugger.

    2. How are you running the program in custom board using emulator(CCS) NO BOOT or Flash boot mode? 

    A)i am using spi boot mode.at the beginning with the use of micro controller, i set the boot pins, then i boot afterwards with my application through spi boot mode.i don't use any CCS  or jtag in this case. This is the final stage to test our custom board.

    Thanks,

    Ram.

  • Ensure that the part selected is within the temperature limits. Please refer the PACKAGE OPTION ADDENDUM and device nomenclature from the data manual.

    Thank you.

  • Hi,
    Thanks for the info.we are using the default case temperature (0 to 85C). is it possible to measure the temperature by using any of DSP registers?Then it is easy for me to input this value to the log file, then analyse at which temperature it is failing.

    Thanks,
    Ram.
  • The temperature is highly dependent on the environment in which the C6657 is used. You can use the information in the Thermal Design Guide for KeyStone Devices from the C6657 product page.

    I think there is no register available to measure the temperature and Thermal design should be based on the expected power consumption rather than measurements of a device.

    Thermal Design (Application Notes/Design Files):

    Power Consumption Model (Under Models)

    Refer below thread for more information,

    Thank you.