This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

8168 2.1 versus 2.0 thermal/efficiency differences

I may have missed it in the documentation but we've observed a noticeable improvement in case temperature (i.e. cooler) when we changed to 2.1 silicon 8168.  

From what I see in the data sheet the specifications for power consumption did not change from 2.0 (...BCYG) to 2.1 (...CCYG), but the observed performance is in the conservative direction so it clearly meets the terms of the data sheet.  

Is this improvement in case temperature expected behavior that we can expect to consistently achieve with the 2.1 version parts?  Or did we just get a lucky lot and we should still expect to see parts that push the other corner of the specifications?

  • Hi Matthew,

    I made a search but I do not find any info regarding thermal update from 2.0 to 2.1 device. The difference between 2.0 and 2.1 device is documented in the DM816x Silicon errata document. You can find there advisories which are specific for 2.0 and have been fixed for 2.1 device.

    Regards,
    Pavel