SM320C6701GLPS16 Need Help with Assembly Process

Vinod Chauhan

Hi,

My question is with specific assembly reflow for the processor device SM320C6701GLPS16. As far as my knowledge any BGA goes through one reflow during the assembly process. I was told that this BGA needs double reflow during the assembly process. Can I get help?

Thank you.

over 9 years ago

0 Senthilkumar Srinivasan over 9 years ago

TI__Mastermind 43660 points

Vinod,

We do have any specific reflow profile details for this GLP package. I will try to contact packaging team if they can provide any inputs on this.

Regards,
Senthil

0 Vinod Chauhan over 9 years ago in reply to Senthilkumar Srinivasan

Prodigy 40 points

Senthil,

Any update yet? Appreciate your help.

Vinod.

0 Senthilkumar Srinivasan over 9 years ago in reply to Vinod Chauhan

TI__Mastermind 43660 points

Vinod,

I am yet to get the response from the packaging team. I will update you soon.

Regards,
Senthil

0 Richard Biddle over 9 years ago in reply to Senthilkumar Srinivasan

TI__Expert 5570 points

Its possible someone is assuming this is a gold-plated leaded part where pre-tinning is needed. This is an Sn63Pb37 BGA and only requires one pass to reflow to the board.

-Richard

0 Vinod Chauhan over 9 years ago in reply to Richard Biddle

Prodigy 40 points

Richard,

Thank you so much for your quick response. For this particular GLP package can you please send me reflow profile if it is other than normal (220 Degree C peak)?
So for the ZMB package where the balls are gold plated what is the specific assembly process? This information will help us for future project.

Thank you,
Vinod.

0 Richard Biddle over 9 years ago in reply to Vinod Chauhan

TI__Expert 5570 points

My pleasure.

Reflow profiles are dependent on numerous factors including, but not limited to, solder type, flux, package type, number of components, board layers, board size, reflow oven type and accuracy as well as pre and post cleaning processes. Because of the number of variables it is not possible to provide a single reflow profile that is representative of every board using a specific package type. Typically manufacturing houses have reflow profiles in place and modify them for specific hardware.

We suggest using the flux manufacturer’s recommended profile as a starting point. In general ceramic parts are compatible with ramp-rates of less than or equal to 5°C/second with a maximum temperature of 265°C. Variations of course need to be comprehended based on time required to volatize the flux prior to the solder reaching liquidus.

The ZMB package is a ceramic land grid array (no solder balls). These are designed to allow the attach of solder columns. Most OEMs use a third party such as Six-Sigma to perform the column attach. I believe the lands are pre-tinned before column attach.

-Richard

0 Vinod Chauhan over 9 years ago in reply to Richard Biddle

Prodigy 40 points

Thank you Richard. Yes it does answer my question.

Vinod.

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SM320C6701GLPS16 Need Help with Assembly Process