Coefficient of Thermal Expansion CTE for 66AK2H12 AAW package

Randy
I am following up internally. However my understanding is that there is no meaningful way to come up with the CTE value for entire processor package - and as far as i know we do not have these values for our processor packages.

I will check with the packaging gurus on what information, if any, can be provided in lieu of it etc.

Regards
Mukul

Randy,

Please provide context for the question. 

The part is a FCBGA part that does not have mold compound.  It does have a substrate which will have CTE values but the part also has a top-hat lid that is very stiff.  It will not expand thermally.  Is there a specific problem that they are trying to solve?

Tom

Randy,

Packaging information available for customers at:

http://www.ti.com/lsds/ti/packaging/packaging_resources/SMT_and_application_notes.page

Tom

Tom,

I do not have any context other than the obvious assumption that it is for determining the stress on the device during power cycling. Comparing the CTE for the TI processor with the CTE for the board would be the way to do that.

The link you sent has a lot of documents. Can you give me a hint which one might have the CTE value for this package? I do not know how to determine what the package material is, and hunting though all of those documents would probably not find me the answer very quickly.

Your pointers would help immensely. [ed - not found in the FCBGA Package Ref Guide SPRU811a]

Regards,
Randy

Randy,

None of those documents contain a simple CTE value for a complex device such as the 66AK2H12. I provided the link to show the types of packaging data available for customers.

If we know the reason for the question from the customer, we can frame an appropriate answer.  Please learn from the end customer the need for this information so that we can provide an appropriate answer.

Tom