BFI(Board Flexure Initiate) Strain guidance

JP Park95

Expert 1100 points

We are using TMS320C6747DZKBA3 device.

Intel provides BFI(Board Flexure Initiate) Strain guidace for each CUP.

Do you have BFI(Board Flexure Initiate) Strain guidance ?

Please provide the BFI Strain guidance document, if you have.

Regards,
JP Park

over 8 years ago

0 Shankari G over 8 years ago

TI__Mastermind 43955 points

Hi JP Park,

Notified your question to an expert.

Thanks for your patience.

0 Shankari G over 8 years ago

TI__Mastermind 43955 points

Hi JP Park34,

As far as we know, no such thing exist for TMS320C6747DZKBA3.

0 Tom Johnson 16214 over 8 years ago in reply to Shankari G

TI__Mastermind 46460 points

JP,

What is your interest with this question? The Board Flexure Initiative was a proposal to revise IPC-JEDEC standards that has not yet been accepted. Intel has proceeded to use this new technique that has not been accepted by the industry. The industry is still using:

IPC/JEDEC-9704 (June 2005) Printed Wiring Board Strain Gage Test Guideline
IPC/JEDEC-9702 (updated August 2016) Monotonic Bend Characterization of Board-Level Interconnects

These are applicable standards for characterizing board flexure and strain during manufacture, shipping and use. Does this answer your question?

Tom

0 JP Park95 over 8 years ago in reply to Tom Johnson 16214

Expert 1100 points

Hi Tom

Thank you for your response.

Your answer has solved this problem.

Thanks,

JP Park

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BFI(Board Flexure Initiate) Strain guidance