Hello Champs,
One of my customer questions regarding TDA3x.
1. The TDA3x EVM schematic(Rev_C1) shows pull-down resistors for GPMC Address bus between NOR Flash(S29GL512S) and SN74CBT16214(Mux IC).
For A0~A11 don’t have pull-down resistors, for A12~A17 have 10K R, for A18~A25 have 1K R.
What is the intention of those R? Why A12~A17 lines and A18~A25 lines have different values of resistors?
(The case of TDA2x EVM there have 10K R from A12~A25.)
If the pull down R need for holding low when Mux IC output is high impedance, then, why there’re no pull-down R for A0~A11? (for both TDA3x and TDA2x board?)
2. instead of S29GL256S10, can they use M29W256GH70N3E for NOR Flash?
3. Is there any method without using multiplexer at the GPMC for reducing their BOM? Because GPMC pins are only used at the booting period, most of the time they may be used for VOUT1.
Thanks,
Ernest Cho