We are experiencing some ESD issues with the OMAP3530CBB and are considering not using the SYS_NRESWARM (AF24) signal. This appears to be a bidir open drain signal. We have this signal running directly to the companion chip (TPS65920) pin B9, which is named RESWARM. In addition, it is pulled up through 100 ohms and the pullup is bypassed with 1000pF cap. We connected these two signals based on reference designs. We are not using a pushbutton switch on this line, as at least one reference design does.
Our system seems to show improved ESD immunity when this signal is tied high. We would like to know if there are reasons why we should not just tie this pin high at the OMAP? For example, will it affect synchronization between the OMAP and companion parts? It would be unfortunate if we pursued this approach, only to later find that it is a restriction.