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boot fail from K9F1208, how can Appro do that in DM355- IPNC(K9F5608)?

I have known that dm355 need ce don't care nand device ,and josef had described that:

http://e2e.ti.com/support/dsp/davinci_digital_media_processors/dm3x/f/100/t/34122.aspx

Now i tie CE0 to ground directly, and use flash_util to write UBL and UBOOT to nand through UART.

Then change boot mode to NANDBOOT, but i still cannot boot from NAND.

when power on, i use oscilloscope to find out that the signal on nand is active.That means dm355 really boot from NAND.

but uart has no response, and GIO61 for booting fail to blink has not response too!!!

can someone give me a hint? josef,are you online?

  • Hi,

    Can you verify to make sure that NAND is compatible with the ROM boot loader?  You can also connect with the emulator and see if the boot load has succeeded and the UBL or u-boot is running.

    Thanks.

    -Tai Nguyen

  • well, RBL support K9F1208 and K9F5608, DM355 IPNC use K9F5608,you know that.

    I found that TI employee only know what device id dm355 supports (from datasheet, so everyone know about that) ,but not know the chip's vendor, although it is samsung.

  • If you are using the DM355 IPNC reference design from Appro, you would be better served asking your question to Appro, as this is not specifically a TI product. This forum is strictly for TI DM3xx device and TI EVM questions. Please direct your non-TI hardware questions to the appropriate hardware vendor.  Also, you will find that replying in a more professional manner would benefit you in the future.

     

  • well, I just ask why the device doesn't work which RBL supports. it's not about third part product,it is about dm355.

    I bet you didn't test all the device in the RBL flash supporting list.

  • What silicon revision of DM355 are you using?  Please see the DM355 silicon errata to determine this based on the package symbolization.

     

     

  • Note also that Samsung is famous for doing die shrinks on their parts and changing only minor letters in the part numbers.  We have seen that some of the die shrinks also incurred a change in the page and/or block sizes for the raw NAND, which has caused issues.  The part numbers you have specified are not full part numbers.  Example full part numbers include K9F1208U0M-YCB0 and K9F1208U0M-YIB0.

  • well,josef had described that:

    http://e2e.ti.com/support/dsp/davinci_digital_media_processors/dm3x/f/100/t/34122.aspx

    My part is K9f1208U0C-PCB0, it's a CE care device . so i have to tie ce0 to ground.if not ,i cannot write data to the flash.

    now i have finished writing data. and has problem described as above.(IPNC also use a CE care device K9F5608, but it can boot, this makes me confuse!!!)

     

  • Hi,

    Back to my first reply to your post, I assumed that you were able to write to the NAND successfully and you think the boot does not happen. I suggest to debug this issue, you can use the emulator to figure out where the ROM boot loader is at and if the UBL or U-boot is running. If they are not, you can use the emulator to read the NAND to see the NAND data is correctly written before.

    Hope this helps.

    Thanks,

    Tai

  • Please provide the silicon revision for your DM355 part, as well, as the ROM code has changed depending on which version you have.

  • the silicon version is TMS320DM355ZCE216. the oldest one. seems IPNC also use this version?

  • From errata (http://focus.ti.com/lit/er/sprz264e/sprz264e.pdf) Page 6, TMS320DM355ZCE216 is Rev 1.1.

    Looking at the datasheet of K9F1208U0C (http://www.alldatasheet.com/datasheet-pdf/pdf/170604/SAMSUNG/K9F1208U0C.html): NAND Device ID: 0x76.

    The parameters from the Device ID table are (Table 11-7, ARM Subsystem Guide (http://focus.ti.com/lit/ug/sprufb3a/sprufb3a.pdf):

    Page Count: 32, Page Size: 512+16, Address cycles: 4

    These parameters matches with the NAND parameters from the NAND datasheet. So apart from the CE (don't care), the device is supported by the RBL.

    The problem could be:

    1. Loose/not connected hardware connection.
    2. The data is not written in the suggested format (Section 11.2.2, ARM Subsystem Guide)

    Assuming write is successful (as suggested), this is unlikley. Can you please provide the details of the flasher utility/UBL used to flash the UBL?  Usually the flasher utility reads back the data to check if the write is successful. Can you please if this step is happening successfully?

    For (2), is the UBL modified? Can you please refer to details on the format of the UBL to be flashed to make sure that there is no problem? Also using the emulator/JTAG for debugging will also help (as suggested earlier).

    Thanks,
    Gaurav

  • the device id is surely supported by RBL,but ce don't care cann't be supported, josef had found out the solution.

    but i didnot use ~ce1 to control it , next step i should change another part. d-a-m-e!