Hello,TI’s engineers!
Our company had developed a 2D decode device based on DM6431, we prepared to produce this kind of instrument.Now,we found some problems on flash boot.
I follow the doc“Secondary Boot for NAND Devices”
1. Compile secondary boot (customize if required)
2. Use genAIS utility to create AIS bootable image for secondary boot code from I2C/SPI
3. Compile application code.
4. Use genAIS utility to create binary AIS bootable image of application code from NAND
5. Use NAND Writer utility to write application AIS image to NAND flash
6. Use I2C Writer utility to write secondary boot AIS image to EEPROM
7. Set BOOTMODE [3:0] = 1001b to select boot from I2C
8. Issue POR reset to DM643x device
I have done all this step,and the device can boot every time.But this method isn’t suitable for mass-produce.
So I write application AIS image to NAND flash and secondary boot AIS image to EEPROM with XELTEK SUPERPRO Model 580U programer.I found The device can boot from EEPROM,but the secondary boot from NAND flash failed.
I hope TI’s engineers give some suggestions for our mass-produce.
PS:NANDdevice:ST NAND512W3A2BN6