Hello,
We have questions about chip layout with FCBGA-538 17x17mm package:
1) We have not found in documentation - sizes of balls/pins. What diameter should the contact pad have? We suppose it's 0.3mm, but we need confirmation from TI's engineers.
2) What technology should we use for the tracing power pins?(which is near the center of chip). Should we make transitional holes between pads, or something else?
The reason of our questions is - There are no remote pins for Via around power pins. And between pads with 0.65 step there are no space for the standard sized Via.
Could you provide some recommendations for the layout of AM5708 please?
Ilya.
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