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AM5726: Thermal stress vs. lifetime

Part Number: AM5726

Hi,

TI has an excellent white-paper regarding how thermal stress affects the useful life (PoH) of embedded CPU:s(Calculating Useful Lifetimes of Embedded Processors,  http://www.ti.com/lit/an/sprabx4/sprabx4.pdf ), which gives a very good insight regarding how environmental factors can be taken into account when designing for a long service-life. Given the release-date of this white-paper and the content I assume that this is valid for the latest generation of Sitara CPU:s (AM57xx devices), is this correct? These are of course calculations and not guaranteed data, but nevertheless a very useful tool to validate designs and estimate field quality. Please confirm the validity of this document.

Regards,

Joakim

  • The factory team have been notified. They will respond here.
  • I passed your question along to someone more qualified to answer. They provided the following reply:

    The white-paper is intended to provide a methodology of estimating the useful life of product. The useful life is very dependent on the actual use conditions as shown in the example in the paper. The methodology provided in the paper takes into account the thermal acceleration factor for estimating the useful life of product. Voltage stress, as well as frequency of the product operation, also contribute to the estimated product useful life. If there is a specific application condition for which an estimate it needed, please provide more details of the use conditions.

    Regards,
    Paul

  • Hi Paul,

    The exact use case is not set yet, so for now we would just like to make sure that the information in the white paper is still valid for the process used for AM57xx. As stated in the document many factors will affect the lifetime of the device.

    Can you please confirm that the white-paper is still valid for AM57xx?

    Thanks and regards,

    Joakim

  • I'm not the expert on this topic. I ask someone from our quality team that is more knowledgeable on this topic to reply.

    Regards,
    Paul
  • The information in the app note is generally applicable to TI embedded processors including AM57xx.  For more specific AM57xx data, TI has planned to author an AM572x application note with Junction Temperature vs. POH curves to provide more detail than the POH data already provided in the AM5726 Data Manual.  While this app note is planned, there is not a completion date set yet.