Part Number: AM5726
Hi,
TI has an excellent white-paper regarding how thermal stress affects the useful life (PoH) of embedded CPU:s(Calculating Useful Lifetimes of Embedded Processors, http://www.ti.com/lit/an/sprabx4/sprabx4.pdf ), which gives a very good insight regarding how environmental factors can be taken into account when designing for a long service-life. Given the release-date of this white-paper and the content I assume that this is valid for the latest generation of Sitara CPU:s (AM57xx devices), is this correct? These are of course calculations and not guaranteed data, but nevertheless a very useful tool to validate designs and estimate field quality. Please confirm the validity of this document.
Regards,
Joakim