AM3352: Via diameter on package

Hi,

With reagrds to AM3352(ZCZ), what is the diameters of the package vias?
Our customer needs this information in order to decide the optimum Solder Land value.




The below wiki page mentions about the Land Diameter as 0.4mm.
processors.wiki.ti.com/.../BGA_PCB_design

But with 0.4mm Land Diameter is bit big and add up the PCB design cost,
0.35mm would be a better option because all other devices on the PCB use 0.35mm pad.
So, in order to decide on this value they may need the details of diameters of the package via.

And also we would like to know which Solder lands on the package is adopted
in case of AM335x, is it Solder-mask-defined (SMD) or Non-solder-mask-defined (NSMD).
It will be helpful to decide which option to use for the Solder lands on the PCB.


Best Regards
Kummi