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AM4378: Referenced datasheet in IDK HW user guide

ay0689_3
Expert 1085 points

Part Number: AM4378

Hello, I can not find  the datasheet references in the following URL. processors.wiki.ti.com/.../AM437x_IDK_EVM_HW_User_Guide

Could you please tell me the location of the datasheet ?

Best regards,

ay0689

  • 0
    TI__Guru**** 393215 points
    Hi,

    These seem to be references to the AM437x Datasheet. Latest revision is D, and the relevant section is 5.13.8.2.1. However these references seem to point to some older version of the datasheet. I will notify the factory team to update the wiki.
  • 0 in reply to Biser Gatchev-XID
    Expert 1085 points

    Hello Biser-san, 

    thank you for your information.

    We need the matching revision of the AM437x datasheet to understand the wiki's content and to proceed our board design. 

    Could you please send it to me?

    Thanks and best regards,

    ay0689

  • 0 in reply to ay0689_3
    TI__Guru**** 393215 points
    I have notified the factory team to update the wiki.
  • 0 in reply to Biser Gatchev-XID
    Expert 1085 points

    Hello Biser-san,

    My colleague sent me the AM437x RevC datasheet. But its contents regarding the tables are the same as RevD(the latest version).

    I searched with keywords of PCB Design Guidelines in RevD datasheet and created the following table.

    PCB Guideline Deviations

    PCB Guidelines deviation with respect to datasheet is provided below.

    S.NoPCB Design GuidelinesDatasheet Reference
    SPRS851D 
    (RevD)    		DeviationReason For deviation
    1 Full VDDS_DDR power reference layers under the DDR3 routing region Table 5-53 Signals other than DDR in Layer 4 are also referenced with the VDDS_DDR power plane Due to Space Constraints
    2 Placement X2 ( DDR device 1 to Device 2 Distance ) - 600 mils (Max) Table 5-54 740 mils To Enable Ease of Routing
    3 VDDS_DDR bulk bypass capacitor count 2 Devices (Min) Table 5-55 Only one bulk capacitor used Due to Space constraints
    4 VDDS_DDR bulk bypass total capacitance 20 μF (Min) Table 5-55 2 x 10 uF capacitors required. But only one 10 uF used Due to Space constraints
    5 DDR3 bulk bypass capacitor count 2 Devices (Min) Table 5-55 One device (22uF) Capacitor used Due to Space constraints
    6 DDR3 bulk bypass total capacitance 20 μF (Min) Table 5-55 One 22uF Capacitor used Due to Space constraints
    7 VDDS_DDR HS bypass capacitor count 20 Devices (Min) Table 5-56 6 bypass capacitors used Due to Space constraints
    8 VDDS_DDR HS bypass capacitor total capacitance 1 μF ( Min) Table 5-56 0.01uF X 6 Capacitors used Due to Space constraints
    9 DDR 1 - 2: DDR3 device HS bypass capacitor total capacitance - 0.85 μF (Min) Table 5-56 0.01uF x14 Capacitors used Due to Space Constraints
    10 CK and ADDR_CTRL nominal trace length - 100 mils (Max) Table 5-59,5-70 More than 200 mils difference Due to Space & Routing Constraints
    11 Split plane crossing ??? Found across the board Due to Space & Routing Constraints

    Table 16: PCB Guidelines Deviations

    I could not find the key word "Split plane crossing" in RevD datasheet. Could you please tell me the table number that corresponds to that meaning in RevD datasheet reference?

    Best regards,

    ay0689

  • 0 in reply to ay0689_3
    TI__Guru**** 393215 points
    This should be Table 5-53 parameter No. 5, also see requirements in section 5.13.8.2.1.3.5