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SM32DM355GCEM216EP PbSn balls

David Smith99
Intellectual 380 points

I have a question regarding part number SM32DM355GCEM216EP.

This BGA part has PbSn balls.

Is it acceptable for me to have this part re-balled to lead free?

  • 0
    TI__Expert 5570 points
    Hi David,

    The commercial version of this device and package does use SnAgCu solderballs. Re-balling the devices would, of course, be at your discretion however it will void the TI warranty.
  • 0 in reply to Richard Biddle
    Intellectual 380 points

    As far is i KNOW we are using the production version....   and the data sheet says SnPB (which is no bueno)   SnAgCu would be perfect and would work for our higher temp application. (125C)

    Can anyone tell what the actual solder-balls are on this chip:    

    SM320

    DM355GCE216

    $4A-03AJGPW

  • 0 in reply to David Smith99
    TI__Expert 5570 points
    The part marking is for the SM32DM355GCEM216EP extended temperature version (-55°C/+125°C) which is only made with SnPb solderballs. I did not find an extended temperature of the 320DM355 with SAC solderballs.

    The SnPb solderball devices are used in defense applications to +125°C with SnPb board solders. While it is usually acceptable to mount SnPb solderball packages using a SAC Pb-free solder process, the converse, using SAC solderball parts with a SnPb solder process, is not recommended.

    Drop me an email at s-biddle@ti.com and I can provide more information.