• State Resolved
  • Locked Locked
  • Replies 6 replies
  • Subscribers 99 subscribers
  • Views 1416 views
  • Users 0 members are here
Support feedback
Options
Options
Related

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

OMAP-L138: Reliability data at different temps

Nate Enos
Genius 9450 points
Part Number: OMAP-L138
Other Parts Discussed in Thread: OMAPL138

Hi team,

Posting for a colleague:

We are validating a TI OMAP device designed into a new product, PN OMAPL138EZWT4.  The OMAP datasheet makes the following declarations:

 

From omap-l138.pdf, 4.1 Absolute Maximum Ratings Over Operating Junction Temperature, pg 77

http://www.ti.com/lit/ds/symlink/omap-l138.pdf

                Max Operating Junction Temperature, TJ             90°C (Commercial)

 

Package NFBGA ZWT 361 pins

From omap-l138.pdf, Table 7-2 Thermal Resistance Characteristics (PBGA Package [ZWT], pg 279)

http://www.ti.com/lit/ds/symlink/omap-l138.pdf

θja = 23.7°C/W

θjc = 7.3°C/W

ψJT = 0.2°C/W

 

From omap-l138.pdf, Table 4-1 Recommended Power-On Hours, pg 80

Silicon Revision E, Speed grade 456MHz  - 100,000 hours

 

I’d like to obtain reliability data (FIT, MTBF, Power on-hours) for each of the OMAP operating conditions below:

Tj = 90°C (max operation temperature guaranteed in datasheet)

Tj = 82.1°C (calculated from Tc=77.9°C, using Pd=0.58W)

Tj = 72°C (20% lower than datasheet maximum specified)

 

Thank you for the help,

Nate

  • 0
    TI__Guru**** 161600 points
    Hi,

    We're looking into this. Feedback will be posted here.

    Best Regards,
    Yordan
  • 0
    TI__Guru* 84565 points
    Hi Nate
    Unfortunately we do not support providing customer usage specific derating on POH for this device family.
    What we have in the datasheet is the only guidance we have typically provided.

    Any additional data , requires us to work with quality team on customer specific use-case and provide the info typically under NDA ( or at least not something we will be able to put on the public forum) - this may be difficult to do with new rules.

    If there is a business justification to pursue the non standard approach , please feel free to reach out to me , with the customer opportunity and we can evaluate the request further.
    What POH is the customer looking to achieve?

    FWIW, this request has started to come up more often across devices and we are investigating how to address this for newer devices with some application note collateral that can t use-case agnostic but device specific temp vs poh profiles. OMAPL138 is not in that list though.

    As a side note you may find the following application note useful
    www.ti.com/lit/sprabx4
    However this application note has data/guidance primarily based on Electromigration, which is one of the dominant wearout mechanisms in semiconductors but not the only mechanism.

    The additional thing to note here is what additional information is typically needed to get data like this (look at the mission profile) , which would typically mean something like e.g

    • 5% @ 70C
    • 10% @ 60C
    • 60% @ 50C
    • 25% < 50C

    Not just a single temp number.

    Regards
    Mukul
  • 0 in reply to Mukul Bhatnagar
    TI__Genius 9450 points
    Thanks Mukul! I appreciate the insight.
  • 0 in reply to Nate Enos
    TI__Genius 9450 points
    Hi Mukul,

    One other quick question, is the 100,000 hours recommended power on hours for 25C or is that at the max Tj (90C)? I'm not sure exactly what POH they need, I think it's more for documentation at the moment.

    Thanks!
    Nate
  • 0 in reply to Nate Enos
    TI__Guru* 84565 points
    Hi Nate
    It is for the max junction temp (not 25C) listed for a specific row in the datasheet (even though the table shows a range).
    Regards
    Mukul