AM5K2E04: AM5K2E04XABDA4

Jared Eberhard

Part Number: AM5K2E04

I understand that the AM5K2E04XABDA4 package is a 1089-pin flip-chip BGA. I can't find if this part is vented. I need to include specific notes in my build file if it is vented.

Please verify that the AM5K2E04XABDA4 package is vented.

Thanks

over 8 years ago

0 Tom Johnson 16214 over 8 years ago

TI__Mastermind 46460 points

Jared,

I am not familiar with a need for venting. I believe that the spaces between the substrate and die and between the die and lid are fully filled. Does this answer your question?

Tom

0 Jared Eberhard over 8 years ago in reply to Tom Johnson 16214

Prodigy 120 points

Tom -

I am interested in whether or not the lid is completely sealed to the substrate or if there is a capability of air to flow between substrate/die and the lid.

Sometimes vent holes are added around the lid epoxy to ensure moisture ingress and egress in the laminate construction. They help avoid moisture buildup and outgassing in the cavity between the substrate/die.

I believe what you are saying is that there are no vents but I want to make sure.

Thanks

0 Tom Johnson 16214 over 8 years ago in reply to Jared Eberhard

TI__Mastermind 46460 points

Jared,

Once I tracked down the proper expert, that confirmed that your assumption was true. The device is vented.

Tom

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AM5K2E04: AM5K2E04XABDA4