Hi,
I have a customer with the following questions:
1. Table7-12 lists two different A3 skew entries, one for single sided DDR3 memories, and one for mirrored. Should these both be the same? We have seen other designs that allowed for a larger A3 skew when doing mirrored devices.
2. Has anyone ever used a dual die part and simply connected the !CS and associated CLK and CE pins together? I’ve dug around the web and cannot find a reason why that couldn’t be done. Especially since the connections are the same as if you had two 8-bit devices instead of a single 16-bit device. Does it have to do with the DDR3 memory construction? If they are truly duel-die and just share the data interface then you should be able to treat them like two discrete devices.
Thanks,
Michael Balourdas
