AM3359: PCB warpage for ZCZ package

Daisuke Maeda

Guru 20245 points

Part Number: AM3359

What is the range of PCB warpage that ZCZ (S-PBGA-N324) package allows?

For other packages (TSBGA, EBGA), the following document describes their range of PCB warpage.

AN-1126 BGA (Ball Grid Array)
http://www.ti.com/lit/an/snoa021c/snoa021c.pdf

"For cavity down packages (TSBGA,EBGA) with ball pitch ? 1mm, the PCB warpage must be carefully
controlled and it is recommended that PCB warpage under the package is < 4 mils."

Is there information for ZCZ?

Best regards,

Daisuke

over 7 years ago

0 Daisuke Maeda over 7 years ago

Guru 20245 points

Hi,

Should I contact my local TI representative about this question?

Best regards,

Daisuke

0 Biser Gatchev-XID over 7 years ago in reply to Daisuke Maeda

TI__Guru**** 393215 points

The factory team have been notified. They will post feedback here.

0 Mukul Bhatnagar over 7 years ago

TI__Guru* 84415 points

Daisuke
We will need to follow up with the SMT team on this.
Will keep you posted on what we hear back.

Regards
Mukul

0 Mukul Bhatnagar over 7 years ago in reply to Mukul Bhatnagar

TI__Guru* 84415 points

Daisuke

Here is the response we received from SMT team

Based on IPC-2221B, Section 5.2.4 Bow & Twist, PCB warpage should not exceed 0.75%.
In other words, the warpage should not exceed 0.0075" per each inch length of the blank PCB.

Please note that this requirement is measurement at room temperature not during reflow.

Note: Warpage of PCB during reflow can come from a lot of factors:
Material, layout (PCB structure), metal contents, reflow profile ramp rate etc.

0 Daisuke Maeda over 7 years ago in reply to Mukul Bhatnagar

Guru 20245 points

Hi Mukul-san,

Thank you for your reply.

For any requirements during reflow, should I contact my local TI representative?

Best regards,

Daisuke

0 Daisuke Maeda over 7 years ago in reply to Mukul Bhatnagar

Guru 20245 points

Hi Mukul-san,

I will show the following document to our customer for other assembly requirements.

Plastic Ball Grid Array SMT Guideline
http://www.ti.com/lit/an/ssza002b/ssza002b.pdf

Best regards,

Daisuke

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AM3359: PCB warpage for ZCZ package