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GND separation in PCB design

Hi Experts,

I have a question from a customer about GND for PCB design.

They are designing PCB with DM365.

Their question is each GND should be separated or all GND can be merged.

If they can merge GND together, then bigger GND plate can be made and it could be better GND.

But they are not sure DM365 needs to have separated GND or not.

Please, let me have your feedback on this issue.

Nara

  • Hi Nara,

    Here is the recommendation from our board expert.

    We would recommend combining grounds.  

    Combined grounds always seem to do better than separating them, even in digital/analog systems.  The only exceptions are when used on shielding for external connectors like Ethernet (when recommended by the phy manufacturer) and on very sensitive analog systems where the ground moat separation is done by someone who has lots of experience with sensitive analog circuits and doing ground moats right in digital systems, and this is only outside the processor area (where a DAC or ADC might be used). We have seen using some EMI ferrites to connect analog ground to digital ground in some cases. 

    For all situations we would recommend a combined ground under the processor.  The advantage of a solid ground plane in that area far outweighs any benefit we’ve seen to separating them.

    Thanks,

    Tai Nguyen