RTOS/TDA3XEVM: Why TDA3X fast boot must use Big Endian?

Ming Zhong9

Part Number: TDA3XEVM

Tool/software: TI-RTOS

Dear experts,

I'm using TDA3X EVM for fastboot test. AppImage is divided into 2 parts: Early & Late. From vision_sdk/build/rtos/makerules/build_multi_core_image_gen.mk, LE AppImage is removed. When I use AppImage_LE in QSPI, MLO report magic number error. And I cannot find anywhere to configure the endian. Why normal boot uses LE, while fastboot uses BE? How to use LE on QSPI fastboot(because some binary data is shared between normal boot & fast boot)? Could you please provide some guide on these questions?

Best Regards!

Zhong Ming

over 8 years ago

0 Rishabh Garg over 8 years ago

TI__Guru 55685 points

Hi Zhong,

When the image is present on QSPI flash the image will be in big endian format due to endianness swap. For NOR flash and SD card the image is in little endian format.
This is true for both normal and fast boot.
I think you are confused with LE AppImage which is used in QSPI_SD boot where application image is on SD card and SBL image is in QSPI.

Regards,
Rishabh

0 Ming Zhong9 over 8 years ago in reply to Rishabh Garg

Intellectual 380 points

Thanks for your reply.
In another word, only data stored in QSPI is BE format, while actual working states of the processor in normal & fastboot are all LE. Am I correct?

0 Rishabh Garg over 8 years ago in reply to Ming Zhong9

TI__Guru 55685 points

Yes. This is correct.

Regards,
Rishabh

Processors

Processors forum

RTOS/TDA3XEVM: Why TDA3X fast boot must use Big Endian?