I've ben looking at the ZCN footprint used on the AM35xx series and cannot determine whether this is intended to be used on a Soldermask Defined Pad PCB or Non-Soldermask Defined Pad PCB. The ball Diameter is given as 0.36mm to 0.46mm and the pad size on the downloadable footprint is 0.3mm. At the low end you could argue that this makes the pads more suitable to SMD whereas at the top end of the ball diameter this is more suitable for NSMD pads. On a previous 0.65mm pitch design I used a 0.275mm NSMD pad without issue.
The Wiki for the AM35x VCA PCB Layout suggests that this footprint is suitable for both based on the comments about thermal relief and it being used for clarity. This is surely not correct as a SMD pad has to be larger than a NSMD pad.
Could someone please suggest recommended pad size for both SMD and NSMD PCBs as they should be different. It would be useful to others if this information was then added to the Wiki as well.
