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AM5728: High-speed differential pair routing

Part Number: AM5728

Customer has questions on AM5728 high speed routing.  Bullet point 4 under Section 3.2 from the High-Speed Interface Layout Guidelines (Rev. G) app note recommends keeping all high speed differential pairs on the top and bottom layers.  Is there more information about how important this is to avoid strip-line routing and why?  

Customer is trying to conclude board constraints tomorrow and it would be helpful to understand this recommendation better, how important it is or isn’t, what difference does it make and how much of a difference.

Thanks,
Mark

  • The factory team have been notified. They will respond here.
  • Hello Mark,
    While microstrip and stripline routing are both viable options, we've found that for most implementations, and at these frequencies, the benefits of microstrip outweigh those of stripline. These benefits include elimination of the need for vias on the high-speed signal pairs and ease of impedance matching/control.

    Regardless of the layout methodology chosen, TI recommends that any PCB be simulated prior to fabrication to ensure that signal integrity/quality requirement are met.