Part Number: AM5728
Hello,
I wondered if you have recommendation for thermal pad to be used with AM5728.
The heat sink manufacturer recommends on TPCM 585.
Please confirm or provide a better substitute.
Thank you,
Yevgeny Virin.
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Part Number: AM5728
Hello,
I wondered if you have recommendation for thermal pad to be used with AM5728.
The heat sink manufacturer recommends on TPCM 585.
Please confirm or provide a better substitute.
Thank you,
Yevgeny Virin.
Hi Yevgeny,
Looking at the material datasheet, this looks good, and will work within the thermal envelope of the processor.
Did you have any specific concerns for your application?
Regards,
Mike
Thank you, Michael, for your comment.
My concern was that tpcm 580 series is with same thermal resistance on 0.005, 0.008 and 0.010" THK. ( 0.02 C in^2/W)
By taking heat sink 40x40mm with forced convection (~ 2.2 C/W ) , I have not a very big safety margin. (T ambient = 50 C , Power =10.5w)
The power consumption is under question:
I wondered, if you can advice regarding it please. According to power consumption datasheet, Dhrystone - Dual Core and Graphics - 3D Chameleon Man consume together :10.5W.
Is this a maximum consumption predicted or it can be higher?
http://www.ti.com/lit/an/sprac79/sprac79.pdf
Thank you,
Yevgeny.
Hi Yevgeny,
We cannot add two benchmarks together to arrive at total power consumption when both use cases are active.
If we use Dhrystone as the baseline, take a look at the voltage domains where power did increase running the Chameleon Man benchmark, such as GPU and DDR, and add the delta as a rough approximation for power consumption running both benchmarks simultaneously.
Regards,
Mike