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AM5728: Thermal phase change material

Part Number: AM5728

Hello,

I wondered if you have recommendation for thermal pad to be used with AM5728.

The heat sink manufacturer recommends on TPCM 585. 

Please confirm or provide a better substitute.

Thank you,

Yevgeny Virin.

  • Hi Yevgeny,

    Looking at the material datasheet, this looks good, and will work within the thermal envelope of the processor.

    Did you have any specific concerns for your application?

    Regards,
    Mike

  • Thank you, Michael, for your comment.

    My concern was that tpcm 580 series is with same thermal resistance on 0.005, 0.008 and 0.010" THK. ( 0.02 C in^2/W)

    By taking heat sink 40x40mm with forced convection (~ 2.2 C/W )  , I have not a very big safety margin.  (T ambient = 50 C , Power =10.5w)

    The power consumption is under question:

    I wondered, if you can advice regarding it please.  According to power consumption datasheet, Dhrystone - Dual Core  and  Graphics - 3D Chameleon Man  consume together :10.5W.

    Is this a maximum consumption predicted or it can be higher? 

    http://www.ti.com/lit/an/sprac79/sprac79.pdf

    Thank you,

    Yevgeny.

     

  • Hi Yevgeny,

    We cannot add two benchmarks together to arrive at total power consumption when both use cases are active.

    If we use Dhrystone as the baseline, take a look at the voltage domains where power did increase running the Chameleon Man benchmark, such as GPU and DDR, and add the delta as a rough approximation for power consumption running both benchmarks simultaneously.

    Regards,
    Mike

  • Hi Mike,
    Thank you for the advise. Indeed the 10.5 W was exaggerated parameter.
    I used Dhrystone as baseline and added the deltas. Eventually the total power stands on 7246 mW.

    Best Regards,
    Yevgeny.