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RTOS/AM4378: AM437 PDK 1.0.12 building

Part Number: AM4378

Tool/software: TI-RTOS

Hi Champs:

May you tell us how to build the PDK example for AM437 PDK1.0.12?

We know we can follow the below doc to do like "gmake demo/ gmake demo_clean".

software-dl.ti.com/.../Examples_and_Demonstrations.html

But, how to build the PDK example for AM437? 

Also, how to build the QSPI Flash loader/writer?

Please explain for each question.

BR Rio

  • Hi,

    Q1. See software-dl.ti.com/.../Examples_and_Demonstrations.html.
    Q2. The QSPI flash writer is built from the top level makefile under pdk_am437x_1_0_xx\packages\ti\starterware, it calls into makefile under pdk_am437x_1_0_xx\packages\ti\starterware\examples\qspi\flash_writer

    Regards, Eric
  • Rio,

    For Q1, I referred to:
    9.3.5. How to Build the Demo
    9.3.5.1. Processor-SDK RTOS

    The top level makefile didn't build this, it is kind of inconvenient. You can see how the makefile looks like for AM335x: processor_sdk_rtos_am335x_5_01_00_11\makefile or the same one for AM57.

    Regards, Eric
  • Hi Eric:

    If RTOS wants to diversity going to every customers, then, to let the user to modify the make file for the BIOS/XDC/PDK is not a smart way.
    The RTOS for each platform has bundled the BIOS/XDC/PDK packages, why we need to let the user to modify the make file.
    Plus, the CCS version will affect the building result.
    This 9.3.5 documents is not a proper example for the CCS version vs each platform + each RTOS versions.

    May you ask the Release team to think another easy way to make it more simple and directly building?
    Honestly, RTOS promoting with Sitara is a hard job, we know how is the customer feeling.
    If Local FAE needs to spend a lot of time to solve this kind lousy job just for make file issue, it will not be a efficiency way.

    Plus the Customer RD needs to spend the time for knowing how to solve this.
    Why Not saving time for making this kind of Lousy job?

    R Rio

    Edit the makefile to include the paths to BIOS, XDC, PDK packages, and the toolchains for the cores being used.

    #DEPOT = <ROOT_INSTALL_PATH>
    #### BIOS-side dependencies ####
    #BIOS_INSTALL_PATH ?= $(DEPOT)\bios_n_nn_nn_nn
    #XDC_INSTALL_PATH ?= $(DEPOT)\xdctools_n_nn_nn_nn_core
    #### BIOS-side toolchains ####
    #TOOLCHAIN_PATH_A15 ?= $(DEPOT)\ccsv6\tools\compiler\gcc-arm-none-eabi-n_n-xxxxqn
    #TOOLCHAIN_PATH_M4 ?= $(DEPOT)\ccsv6\tools\compiler\ti-cgt-arm_x.x.x
  • Hi Eric:

    -->For Q1, I referred to:
    9.3.5. How to Build the Demo
    9.3.5.1. Processor-SDK RTOS

    This section is only mention on the path like this to build:
    C:\TI\processor_sdk_rtos_am437x_5_01_00_11

    Q1: But, how about the PDK examples?

    Can you address more precisely for making this?
    ==>it calls into makefile under pdk_am437x_1_0_xx\packages\ti\starterware\examples\qspi\flash_writer

    how is the exactly building command / sequences?

    BR Rio

    BR Rio
  • Rio,

    1. I looked at the P-SDK 5.0 release for AM437x, the makefile under processor_sdk_rtos_am437x_5_00_00_15 doesn't build the posix-demo. The newer 5.1 release, the makefile under processor_sdk_rtos_am437x_5_01_00_11 has this included and you should be able to build the demo using "gmake demo" for this purpose.

    The user guide portion needs to be updated, just using the makefile under processor_sdk_rtos_am437x_5_xx_xx_xx to build all the demos, this is also how AM335x, AM57x does.

    2. I agree that we need to make the build process clear.

    3. For PDK examples, we mentioned the build process: software-dl.ti.com/.../Overview.html, this including build driver libraries and test examples.

    4. For build "starterware\examples\qspi\flash_writer", the Starterware support is obsolete and we are promoting Processor SDK RTOS. Some starterware code are still there for reference. If you want to build it,

    pdk_am437x_1_0_12\packages>gmake starterware

    This is no difference than you build another driver like I2C, UART, SPI, etc....

    Regards, Eric
  • Also, attached is my build log.

    Regards, Ericam437_build.txt

  • Thank you very much, Eric.

    Appreciated.

    I have worked out the SOP for making this as the attached, please review.

    How_to_Build_AM437_PDK_SOP_By_TI_Rio.pdf

    BR Rio

  • Thanks Rio,

    The document looks good! The Processor SDK RTOS user guide is for all platforms and the material is long. It is very helpful to extract some quick start guide style info as you did! Thanks!

    Regards, Eric
  • Hi Eric:

    Sorry, as the mail I sent to you, the 2nd QSPI boot will not give us the below log.
    How to solve it?

    BR Rio

    Copying Header of the application image
    Copying image from flash to DDR
    Jumping to StarterWare Application...
  • Hi Eric:

    Can you review this E2E:
    e2e.ti.com/.../657731


    BR Rio
  • Rio,

    Q1. QSPI slow boot on TI AM437x IDK EVM (25 seconds).
    See: www.ti.com/.../spruii2.pdf

    2.5.1 Boot Configuration Various boot configurations can be set using the pullup and pulldown resistor combinations provided on the SYSBOOT pins (LCD_D0:15, LCD_VSYNC, LCD_HSYNC, and LCD_EN). Boot configuration pins are latched upon deassertion of the PORz pin. The default settings for the AM437x IDK EVM 1.3A are 000_0100_0000_0001_1000b. This corresponds to a boot sequence of the following: 1. MMC0 2. USB_MS (USB1) 3. USB_CL (USB0) 4. QSPI

    So the QSPI is the last one to boot, after the previous boot methods time-out. You need board modification to change the order.

    Q2. What is Releases you tested AM437x OSPI boot? It was found that QSPI boot failed in Rel 5.1, we have a bug tracking for this and will be fixed on Rel 5.2.

    Regards, Eric
  • Hi Eric.

    We are using the 5.01 release.

    Is the 5.01 equal to the 5.1 release you used?

    How long we need to wait the 5.2?

    Do you have the working patch for this?

    BR Rio

  • Hi Rio,

    • Release 5.1 I meant: processor_sdk_rtos_am437x_5_01_00_11/pdk_am437x_1_0_12.
    • For Rel 5.2, we are doing the sanity test of the release candidate, it should come out by end of this year.

    Regards, Eric