Part Number: AM5748
As the reference design in TMDKIDK574, it uses 256x16 as the ECC memory, and 2 chips of 256 x 16 in EMIF1, and 2 chips of 256 x 16 in EMIF2,
I was wondering if I could use 512x 8 as ECC, and 512 x 16 in EMIF1 and 2 chips of 512 x 16 in EMIF2 with the total memory of 512MB ECC & 3GB DDR3L?
And the maximum memory capacity should be less than 4GB including ECC and normal Memory, right?
Hi，James：
As in the TMDXIDK574_SCH and also Figure 15-47, they all use two X16 chip in EMIF1 and all use MT41K256M16TW-107:P in normal usage and also ECC meathead, but your ECC Controller has only 8bit ECC_D[7..0], so MT41K256M16TW-107:P has only be used in 8bit mode for 256MB, is that right?
Our purpose is use 2GB in EMIF1 and 2GB in EMIF2, and each EMIF will select 2 chips of ISSI IS43TR16512BL-125KBLI with 512M x16 in Mirrored Mode, and totle will be 4GB.
So my question is can I add on a X8 DDR3L only for ECC usage like 512M x8 as the result of 512MB and what the maximun capacity in ECC mode.
And for EMIF1, if the whole capacity in ECC + Normal usage DDR3L should be less than 2GB?
