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TMS320C6727B: reflow soldering thermal profile

Naoki Kawada
Guru 19890 points
Part Number: TMS320C6727B

Hello,

My customer has a question about reflow soldering thermal profile for TMS320C6727BZDH. Could you suggest ?

Best Regards,
NK

  • 0
    TI__Guru**** 393215 points
    Hi,

    Reflow profile can be found on the product page: www.ti.com/.../pinout-quality
  • 0 in reply to Biser Gatchev-XID
    Guru 19890 points
    Hello Biser,

    Thanks for your reply. I believe Level-3-260C-168 HR found in the table is the profile the customer wants. I believe this is JEDEC spec. Which JEDEC part number should i refer to find the exact graph(temp vs time) ?

    Best Regards,
    NK
  • 0 in reply to Naoki Kawada
    Guru 19890 points

    Hello,

    Any response ?

    Best Regards,
    NK

  • 0 in reply to Naoki Kawada
    TI__Mastermind 46460 points

    Naoki-san,

    Please refer to Section 4.4 of the Flip Chip Ball Grid Array Package Reference Guide (SPRU811) at www.ti.com/.../SPRU811 for generalized guidance for the recommended BGA reflow profile.  This must be optimized per the board design and the reflow oven.

    Tom

  • 0 in reply to Tom Johnson 16214
    Guru 19890 points

    Hello Tom,

    Thank you for your suggestion. I found the temp vs time graph for reflow in the document. Can i ask one more thing ? What is actually meant by "Level-3-260C-168 HR" described in the pin-out product page ?

    Best Regards,
    NK

  • 0 in reply to Naoki Kawada
    TI__Mastermind 46460 points

    Naoki-san,

    This is also discussed in SPRU811 in section 8.1.  That is the MSL or Moisture Sensitivity Level and the Peak Reflow Temp rating.  This information in this format is for JEDEC compliance.  This information is also printed on all of the IC packaging.

    If you go to the TMS320C6727B product page, then click on the "Quality & packaging tab, then click "View" for the part number of interest under the "Material content" column, then you can click on the hyperlink in the heading for "MSL/reflow ratings".  This will take you to a reference page for packaging terminology at this location:

    which has a wealth of additional information.

    Tom

  • 0 in reply to Tom Johnson 16214
    Guru 19890 points
    Hello Tom,

    Thank you for your additional information.

    According to www.ti.com/.../pinout-quality, the target device has SNAGCU ball finish.
    So the customer should refer Figure 23. Recommended Lead-Free Reflow Profile for SnAgCu Solder Paste for the reference in the suggested document -- Is my understanding correct ?

    And the "Level-3-260C-168 HR" indicates max 260*C peak for reflow process. This means the customer must not exceed 260*C during heating. Is my understanding correct ?

    My customer has to confirm their current thermal profile for reflow is applicable or not.
    Sorry to rush you, but could you please give me your answer very soon ?

    Best Regards,
    NK
  • 0 in reply to Naoki Kawada
    Guru 19890 points

    Hi Tom,

    I found the following document on ti web site:

    This document suggests :

    4 MSL Classification Reflow Profile for Lead-Free Soldering The Classification Profile (Not to scale) table in the IPC/JEDEC-020 shows the classification reflow profile to be used for the device MSL classification/certification by the component manufacturer with the maximum reflow temperature Tp .

    Can I understand that referring IPC/JEDEC-020 (The latest version looked E) is the answer to our questions ? As i mentioned in the previous posts, my customer would like to have the exact reflow profile graph for the device.

    Best Regards,
    NK

  • 0 in reply to Naoki Kawada
    TI__Mastermind 46460 points

    Naoki-san,

    The document that you attached, SPRABY1A, contains all of the information that you are seeking.  It is based on the JEDEC specifications sited so they are applicable as well but wiull not have any additional information.  Note that this is still generalized guidance.  We, TI, cannot provide an exact profile.  The profile must be adjusted and/or optimized for the size and density of the board and components as well as for the specific oven and process used.

    Tom

  • 0 in reply to Tom Johnson 16214
    TI__Mastermind 46460 points

    Naoki-san,

    Specifically, as stated in the MSL code:

    Level-3-260C-168 HR:

    • MSL Level = 3
    • Peak reflow temp = 260C
    • Maximum floor time before reflow = 168 hours (MSL level 3)

    Tom

  • 0 in reply to Tom Johnson 16214
    Guru 19890 points
    Hello Tom,
    Thank you for the clarification. I close the thread.

    Best Regards,
    NK