SMJ320C6701: SMJ320C6701 MECHANICAL DATA

Nancy Wang

Expert 8210 points

Part Number: SMJ320C6701

Hi,

The customer bought SMJ320C6701GLPW14.

Package type:CFCBGA.

Package Drawing:GLP

This is SMJ320C6701GLPW14:

But that different from GPL package drawing in in datasheet.

Is the manual incorrect? Is there a PCN file which customer can modify?

over 7 years ago

0 Christian Yots over 7 years ago

TI__Genius 14540 points

Hi,

Why do you say the drawing does not match the picture of the device? There appears to be 21 colomns of balls on the grid in the picture although picture does not show the full width of the device. Can you please clarify?

Thanks

Christian

0 Christian Yots over 7 years ago

TI__Genius 14540 points

Hi,

Why do you say the drawing does not match the picture of the device? There appears to be 21 columns of balls on the grid in the picture although picture does not show the full width of the device. Can you please clarify?

Thanks

Christian

0 Nancy Wang over 7 years ago in reply to Christian Yots

TI__Expert 8210 points

0 Nancy Wang over 7 years ago in reply to Christian Yots

TI__Expert 8210 points

Hi,

Any update?

0 Christian Yots over 7 years ago in reply to Nancy Wang

TI__Genius 14540 points

I have asked our quality engineer to look at this. I will get back with once I hear back from him.

Thanks

Christian

0 Christian Yots over 7 years ago in reply to Christian Yots

TI__Genius 14540 points

I received the following from our quality team:

"The GLP package was originally released with the swaged or “top hat” solder sealed lid. Several years ago it was changed to a seal ring and a welded flat lid. The drawing apparently was not updated.

The seal ring and lid configuration is the same for the GLP package ceramic flip chip ball grid array (CFCBGA) and the ZMB ceramic flip chip land grid array (CFCLGA).

This was documented in PCN 20070809002 (attached)."

Thanks,

Christian

PCN20070809002_Final.pdf

Processors

Processors forum

SMJ320C6701: SMJ320C6701 MECHANICAL DATA