We have a complicated design, Where heat dissipation from the DSP TMS320C6748EZWTD4 is very critical.
I am looking for the answer of following questions
1) Whether TMS320C6748EZWTD4 is a flip-chip or wirebond package.
2) Heat dissipation is better from IC-Package surface or BGA?
(Our thermal team may design to dissipate heat from BGA as well) .
3) Is there any application note available to provide more information on efficient heat dissipation method for DSP part (TMS320C6748EZWTD4 )?
