Hi
I am glad to receive the LPDDR4 design guide file. I used it well for this artwork.
However, I haven't found any other high-speed impedance line (MIPI, SGMII, RGMII, USB, DP etc) design guides.
Currently, the following documents are referred to.
High-Speed Layout Guidelines for Signal Conditioners and USB Hubs (SLLA414–August 2018)
I have some questions.
1. Is there no need for length matching of TX group and Rx group in RGMII Interface?
2. Do Tx_Pair, Rx_Pair, and Ref.CLK_Pair only match intra-pair-skew in SGMII Interface?
Is there a maximum allowance for inter-pair-skew?
Should I place the AC coupled Capacitors close to the Transmitters?
3. Does Intra-pair-skew need to be length matched in DP (Display port) and USB3.0? What is the maximum allowable length of inter-pair-skew?