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TDA2SX: High temperature durability test

Part Number: TDA2SX

Hardware platform: TDA2SX+TPS659039;

While all functional modules work at the same time, system can't pass High temperature durability test(system work at 85 ℃  temperature ); 

Work load as below:

1. 2x Cortex A15 ARM: 30%

2. 2x DSP: 25%

2. 2xGPU: 70%; 2D/3D view

3. 4x EVEs: 70%, obstacles detection

Please give us suggestion:

1. Reduce power consumption: transfer GPU function to DSP and reduce power consumption;

2. improve heat dissipation: enlarge heat sink;

  • Hi Joseph

    If I understand the question correctly, the system is working consistently at 85 ℃  temperature but at high temp, this is failing. Can you please clarify at what temperature is the system failing?

    Have you measured the junction temperature at the point where it is failing? When you say it is failing do you see that the device is getting to a thermal shut down?

    Which software are you using to test this scenario? Are you making sure the CPUs are able to go to Idle state and able to turn off the clocks for the CPU during the Idle time?

    You can refer to http://www.ti.com/lit/an/sprac22/sprac22.pdf for more details on software techniques to optimize power.

    Also, are you making sure you are setting AVS Class 0?

    Thanks and Regards

    Piyali

  • System is working consistently at 85 ℃  temperature, software platform: the latest Vision_SDK BSP; 

    mechanical engineer designed heat sink for TDA2x, we got temperature is over 120 ℃ from TDA2X internal temperature sensor. we used external thermocouple to touch chipset case to get 117 ℃;

    System will reboot while junction temperature is over 120℃, somtimes system fail to reboot.

  • Hi Joseph

    First thing to check would be if AVS Class 0 is applied in the software. This is critical to ensure you are not applying more voltage than necessary and is found to be a key knob to reduce self power dissipation.

    Thanks and Regards

    Piyali