66AK2H06: Maximum downward pressure on the package

Koichiro Tashiro

Part Number: 66AK2H06

Hi,

My customer wants to know the maximum downward pressure on 66AK2H06 package.

The information is similar to one below in Intel website.
https://www.intel.com/content/www/us/en/programmable/support/support-resources/knowledge-base/solutions/rd04172001_4367.html

Thanks and regards,
Koichiro Tashiro

over 4 years ago

0 Rex Chang over 4 years ago

TI__Guru 50170 points

Hi, Koichiro,

Here is the info you are looking for. Hope it helps.

Rex

0 Koichiro Tashiro over 4 years ago in reply to Rex Chang

TI__Mastermind 22110 points

Hi Rex,

Thanks for your quick reply.

Suppose the application requires 20 years @ 100C, the maximum load is 109 [g/ball].
The package has 1517 balls, so total 165kg is the maximum load, correct?
This is really big.

Thanks and regards,
Koichiro Tashiro

0 Rex Chang over 4 years ago in reply to Koichiro Tashiro

TI__Guru 50170 points

Hi, Koichiro,

Comparing with the link you posted. It is also per ball pressure. I don't know if that should be the way to look at it by multiply total number of balls.

Rex

0 Koichiro Tashiro over 4 years ago in reply to Rex Chang

TI__Mastermind 22110 points

Hi Rex,

I see.

I have another question from customer.
When a heat sink is mounted on PCB, the heat sink is screwed like below figure.
Is there any guidelines for substrate warpage ?

Thanks and regards,
Koichiro Tashiro

0 Tom Johnson 16214 over 4 years ago in reply to Koichiro Tashiro

TI__Mastermind 46460 points

Koichiro,

You will need to use some type of spring-mounted support for the heatsink like we did on the EVM. Warpage is not the only concern. There is also thermal expansion and the BGA attachment may not result in a co-planar attachment. The heatsink support must allow for this while maintaining robust contact with teh top of the SOC.

Tom

Because of the holidays, TI E2E™ design support forum responses will be delayed from Dec. 25 through Jan. 2. Thank you for your patience.

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66AK2H06: Maximum downward pressure on the package