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TMS320VC5509A: Microstar BGA and nFBGA differences

Part Number: TMS320VC5509A

Hi,

My customer using below DSP parts and recently receive EOL notice of MicroStar BGA package.
TMS320VC5509AZHH
TMS320VC5410AZGU16

Recommended replacement parts are nFBGA package
TMS320VC5509AZAY
TMS320VC5410AZWS16

According to PDN document, these replacement parts are categorized as "Replacement code=Q" which means;
“Same functionality and PIN-OUT as the compared device but is NOT an exact equivalent.”

According to datasheet, PIN-OUT and functionality are the same and PCB Land patterns are also the same.
What is the differences between these packages in customer’s point of view?
They can simply replace it with new one?

Thanks and regards,
Koichiro Tashiro

  • Hello,

    The differences between the microstar and nfbga packages for the products are primarily mechanical (specifically a minor height difference).  The key parameters for the two packages are the same. The paths for the nfbga package substrate was designed to enable the parts to be considered datasheet equivalent (share the same datasheet; and power, ground and signal pins are all in the same X-Y locations).

     Board Layout Considerations:

    The nFBGA package provides the same X and Y dimensions as MicroStar BGA, and provides pin-to-pin and footprint compatibility. Minor adjustments in pick and place machine programming may be needed because of slight package and tray differences. The nfBGA package can solder to the Microstar BGA land pattern. However, there have been improved nFBGA PCB land pattern and stencil recommendations to achieve better soldering results after extensive testing and evaluation since the microstar package was developed. Please refer to the latest TI packaging drawing found in the latest TI device datasheet and datasheet addendum to review the package dimensions and latest PCB land pattern and stencil recommendation. For more details, check out this nFBGA application note